FPC Circuit Boards Production Capacity
Item Standard FPC HDI Flex PCB Rigid-flex PCB
Panel Size 1200x500mm 100*100mm 250*400mm
Line Width/Space .003'' (0.076mm) .00075'' (19um) .003'' (0.076mm)
Copper Thickness 1/2oz - 4oz 1/4 to 1/2oz 1/2 oz - 4oz
Layer Count 30 layer 18 layer 8 layer
Via / Drill Dia.
Min Drill (Mechanical) Hole Dia. .008'' (0.2mm) .006'' (0.15mm) .008'' (0.2mm)
Min Via (Laser) Dia. 5mil (0.13mm) 3mil (0.076mm) 6mil (0.15mm)
Min Micro-via (Laser) Dia. 3mil (0.076mm) 3mil (0.076mm) 3mil (0.076mm)
Stiffener Material PI / FR4 / Metal/Aluminum/Copper/3M tape PI / FR4 / Metal/Aluminum/Copper/3M tape PI / FR4 / Metal/Aluminum/Copper/3M tape
Shielding Material Copper Copper Copper
Silver Ink Silver Ink Silver Ink
Tatsuta Tatsuta Tatsuta
Carbon Carbon Carbon
Tooling Tolerance 2mil (.051mm) 2mil (.051mm) 2mil (.051mm)
Routing Tolerance 2mil (.051mm) 1mil (.025mm) 2mil (.051mm)
Solder Mask
Solder Mask Bridge Between Dam 3mil (0.075mm) 3mil (0.075mm) 3mil (0.075mm)
Solder Mask Registration Tolerance 3mil (0.075mm) 3mil (0.075mm) 3mil (0.075mm)
Coverlay
Coverlay Registration 8mil (0.20mm) 5mil (0.13mm) 8mil (0.20mm)
PIC Registration 7mil (0.18mm) 4mil (0.10mm) 7mil (0.18mm)
Solder Mask Registration 5mil (0.13mm) 4mil (0.10mm) 5mil (0.13mm)
Stiffener
Polyimide (PI) Stiffener Registration
Stiffener Registration 10mil (0.25mm) 10mil (0.25mm) 10mil (0.25mm)
Thickness Tolerance 10% 10% 10%
FR4 Stiffener
Stiffener Registration 10mil (0.25mm) 10mil (0.25mm) Layer to Layer
Thickness Tolerance 10% 10% 5mil
Silkscreen /Legend
Min Height 35mil (0.89mm) 25mil (0.64mm) 35mil (0.89mm)
Min Width 8mil (0.20mm) 6mil (0.15mm) 8mil (0.20mm)
Min Space 8mil (0.20mm) 6mil (0.15mm) 8mil (0.20mm)
Registration +/-5mil (0.13mm) +/-5mil (0.13mm) +/-5mil (0.13mm)
Impedance +/-10% +/-10% +/-10%
SRD (Steel Rule Die)
Outline Tolerance 5mil (0.13mm) 2mil (.051mm) 5mil (0.13mm)
Min Radius 5mil (0.13mm) 4mil (0.10mm) 5mil (0.13mm)
Inside Radius 20mil (0.51mm) 10mil (0.25mm) 31mil (0.79mm)
Min Punching Hole Dia. 40mil (1.02mm) 31.5mil (0.80mm) N/A
Pucnhing Hole Dia. Tolerance +/-2mil (0.05mm) +/-1mil (0.03mm) N/A
Slot Width 20mil (0.51mm) 15mil (0.38mm) 31mil (0.79mm)
Tolerance of Hole To Outline +/-3mil (0.076mm) +/-2mil (0.05mm) +/-4mil (0.10mm)
Tolerance of Hole Edge To Outline +/-4mil (0.10mm) +/-3mil (0.076mm) +/-5mil (0.13mm)
Min Size of Trace To Outline 8mil (0.20mm) 5mil (0.13mm) 10mil (0.25mm)
Surface treatment process
surface treatment Attribute Routine standard
Nickel thickness   1~10um 
Electric  gold Gold thickness (general specification) 0.01um~0.05um
Gold thickness (thick gold specification) 0.05um~0.76um
Immersion gold Nickel thickness 1~5um
Gold thickness 0.025um~0.1um
Immersion Tin Tin thickness 5~15um
Nickel thickness 3~4um
ENEPIG Palladium thickness 0.05um(Min)
Gold thickness 0.05~0.09um